? 2014 littelfuse, inc. specifcations are subject to change without notice. revised: 06/17/14 description applications the sphv-c series is designed to replace multilayer varistors (mlvs) in portable applications, led lighting modules, and low speed i/os. it will protect sensitive equipment from damage due to electrostatic discharge (esd) and other overvoltage transients. the sphv-c series can safely absorb repetitive esd strikes above the maximum level of the iec61000-4-2 international standard (level 4, ?8kv contact discharge) ?without performance degradation and safely dissipate up to 8a (sphv12-01etg-c) of induced surge current (iec61000-4-5, t p =8/20s) with very low clamping voltages. features sphv-c series 200w discrete bidirectional tvs diode pinout functional block diagram life support note: not intended for use in life support or life saving applications the products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. 1 2 1 2 ? led lighting modules ? portable instrumentation ? general purpose i/o ? mobile & handhelds ? rs232 / rs485 ? can and lin bus rohs pb green ? esd, iec61000-4-2, 30kv contact, 30kv air ? eft, iec61000-4-4, 40a (5/50ns) ? lightning, iec61000-4-5, 8a (t p =8/20s, sphv12- 01etg-c) ? low clamping voltage ? low leakage current ? small sod882 packaging helps save board space ? aec-q101 qualifed tvs diode arrays (spa ? diodes) general purpose esd protection - sphv-c series
? 2014 littelfuse, inc. specifcations are subject to change without notice. revised: 06/17/14 notes: caution: stresses above those listed in absolute maximum ratings may cause permanent damage to the device. this is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specifcation is not implied. absolute maximum ratings symbol parameter value units p pk peak pulse power (t p =8/20s) 200 w t op operating temperature -40 to 125 c t stor storage temperature -55 to 150 c thermal information parameter rating units storage temperature range -55 to 150 c maximum junction temperature 150 c maximum lead temperature (soldering 20-40s) 260 c sphv12-01etg-c electrical characteristics (t op =25oc) parameter symbol test conditions min typ max units reverse standoff voltage v rwm i r 1a 12.0 v reverse breakdown voltage v br i r =1ma 13.3 v leakage current i leak v r =12v 1. 0 a clamp voltage 1 v c i pp =1a, t p =8/20s, fwd 19.0 v i pp =8a, t p =8/20s, fwd 25.0 v dynamic resistance 2 r dyn tlp, t p =100ns, i/o to gnd 0.48 ? peak pulse current i pp t p =8/20s 8.0 a esd withstand voltage 1 v esd iec61000-4-2 (contact discharge) 30 kv iec61000-4-2 (air discharge) 30 kv diode capacitance 1 c d-gnd reverse bias=0v, f=1mhz 30 pf SPHV15-01ETG-C electrical characteristics (t op =25oc) parameter symbol test conditions min typ max units reverse standoff voltage v rwm i r 1a 15.0 v reverse breakdown voltage v br i r =1ma 16.7 v leakage current i leak v r =15v 1. 0 a clamp voltage 1 v c i pp =1a, t p =8/20s, fwd 22.0 v i pp =5a, t p =8/20s, fwd 30.0 v dynamic resistance 2 r dyn tlp, t p =100ns, i/o to gnd 0.43 ? peak pulse current i pp t p =8/20s 5.0 a esd withstand voltage 1 v esd iec61000-4-2 (contact discharge) 30 kv iec61000-4-2 (air discharge) 30 kv diode capacitance 1 c i/o-gnd reverse bias=0v, f=1mhz 24 pf note: 1 parameter is guaranteed by design and/or device characterization. 2 transmission line pulse (tlp) with 100ns width and 200ps rise time. note: 1 parameter is guaranteed by design and/or device characterization. 2 transmission line pulse (tlp) with 100ns width and 200ps rise time. tvs diode arrays (spa ? diodes) general purpose esd protection - sphv-c series
? 2014 littelfuse, inc. specifcations are subject to change without notice. revised: 06/17/14 sphv24-01etg-c electrical characteristics (t op =25oc) parameter symbol test conditions min typ max units reverse standoff voltage v rwm i r 1a 24.0 v reverse breakdown voltage v br i r =1ma 26.7 v leakage current i leak v r =24v 1. 0 a clamp voltage 1 v c i pp =1a, t p =8/20s, fwd 36.0 v i pp =3a, t p =8/20s, fwd 50.0 v dynamic resistance 2 r dyn tlp, t p =100ns, i/o to gnd 0.65 ? peak pulse current i pp t p =8/20s 3.0 a esd withstand voltage 1 v esd iec61000-4-2 (contact discharge) 24 kv iec61000-4-2 (air discharge) 30 kv diode capacitance 1 c i/o-gnd reverse bias=0v, f=1mhz 17 pf sphv36-01etg-c electrical characteristics (t op =25oc) parameter symbol test conditions min typ max units reverse standoff voltage v rwm i r 1a 36.0 v reverse breakdown voltage v br i r =1ma 40.0 v leakage current i leak v r =36v 1. 0 a clamp voltage 1 v c i pp =1a, t p =8/20s, fwd 52.0 v i pp =2a, t p =8/20s, fwd 65.0 v dynamic resistance 2 r dyn tlp, t p =100ns, i/o to gnd 1.33 ? peak pulse current i pp t p =8/20s 2.0 a esd withstand voltage 1 v esd iec61000-4-2 (contact discharge) 15 kv iec61000-4-2 (air discharge) 20 kv diode capacitance 1 c i/o-gnd reverse bias=0v, f=1mhz 13 pf non-repetitive peak pulse power vs. pulse time pu ls e du ra ti on - t p ( s) p eak pu ls e po we r - p pk (k w) 0.01 0. 1 1 10 0. 11 10 100 1000 note: 1 parameter is guaranteed by design and/or device characterization. 2 transmission line pulse (tlp) with 100ns width and 200ps rise time. note: 1 parameter is guaranteed by design and/or device characterization. 2 transmission line pulse (tlp) with 100ns width and 200ps rise time. tvs diode arrays (spa ? diodes) general purpose esd protection - sphv-c series
? 2014 littelfuse, inc. specifcations are subject to change without notice. revised: 06/17/14 pulse waveform 0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% 0.0 5.0 10.0 15.0 20.0 25.0 30.0 time (s) percent of i pp 0 2 4 6 8 10 12 14 16 18 20 05 10 15 20 25 30 sp hv12 c tl p vo lt ag e (v ) tl p cu rr en t (a ) sphv12-01etg-c transmission line pulsing(tlp) plot 0 2 4 6 8 10 12 14 16 18 20 05 10 15 20 25 30 35 sp hv15 -c tl p vo lt ag e (v ) tl p cu rr en t (a ) SPHV15-01ETG-C transmission line pulsing(tlp) plot 0 2 4 6 8 10 12 14 16 18 20 05 10 15 20 25 30 35 40 45 50 55 sp hv24 -c tl p vo lt ag e (v ) tl p cu rr en t (a ) sphv24-01etg-c transmission line pulsing(tlp) plot sphv36-01etg-c transmission line pulsing(tlp) plot 0 2 4 6 8 10 12 14 16 05 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 sp hv36 -c tl p vo lt ag e (v ) tl p cu rr en t (a ) tvs diode arrays (spa ? diodes) general purpose esd protection - sphv-c series
? 2014 littelfuse, inc. specifcations are subject to change without notice. revised: 06/17/14 pulse waveform 0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% 0.0 5.0 10.0 15.0 20.0 25.0 30.0 time (s) percent of i pp power derating curve 0 10 20 30 40 50 60 70 80 90 100 110 02 55 07 51 00 12 51 50 am bi en t te mp er at ur e - t a ( o c) % of ra ted po we r i pp ti me te mperature t p t l t s(max) t s(min) 25 t p t l t s time to peak temperature preheat p rehea t ramp-up r amp-up ramp-down r amp-d o critical zone t l to t p c ritical zo n e t l to t p refow condition pb C free assembly pre heat - temperature min (t s(min) ) 150c - temperature max (t s(max) ) 200c - time (min to max) (t s ) 60 C 180 secs average ramp up rate (liquidus) temp (t l ) to peak 3c/second max t s(max) to t l - ramp-up rate 3c/second max refow - temperature (t l ) (liquidus) 217c - temperature (t l ) 60 C 150 seconds peak temperature (t p ) 260 +0/-5 c time within 5c of actual peak temperature (t p ) 20 C 40 seconds ramp-down rate 6c/second max time 25c to peak temperature (t p ) 8 minutes max. do not exceed 260c soldering parameters ordering information part number package marking min. order qty. sphv12-01etg-c sod882 b2 10000 SPHV15-01ETG-C sod882 b5 10000 sphv24-01etg-c sod882 b4 10000 sphv36-01etg-c sod882 b6 10000 product characteristics lead plating pre-plated frame lead material copper alloy lead coplanarity 0.0004 inches (0.102mm) substitute material silicon body material molded epoxy flammability ul 94 v-0 notes : 1. all dimensions are in millimeters 2. dimensions include solder plating. 3. dimensions are exclusive of mold fash & metal burr. 4. blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. package surface matte fnish vdi 11-13. tvs diode arrays (spa ? diodes) general purpose esd protection - sphv-c series
? 2014 littelfuse, inc. specifcations are subject to change without notice. revised: 06/17/14 part numbering system part marking system sphv ** 01 t g voltage number of channels package t= tape & reel g= green ? tvs diode arrays (spa ? diodes ) e: sod882 e ? c bidirectional b * 2: sphv12-01et g-c 5: sphv15-01et g-c 4: sphv24-01et g-c 6: sphv36-01et g-c 12 embossed carrier tape & reel specifcation sod882 f eeding direction t op mark and pin 1 direction in t ape and r eel bx 1 2 package dimensions sod882 recommended soldering p ad layout symbol package sod882 jedec mo-236 millimeters inches min typ max min typ max a 0.0 1. 0 0 1. 10 0.037 0.039 b 0.50 0.60 0.0 0.022 0.024 0.026 c 0.40 0.50 0.60 0.016 0.020 0.024 d 0.45 0.018 e 0.20 0.25 0.35 f 0.45 0.50 0.55 0.018 0.020 0.022 symbol millimeters a 0.0-0.045 b 1.10-0.045 c 0.65-0.045 d 1.55-0.10 e 1.5-0.05 f 3.50+/-0.05 p 2.00-0.10 p0 4.00-0.10 p1 2.00-0.10 w 8.00 + 0.30 -0.10 tvs diode arrays (spa ? diodes) general purpose esd protection - sphv-c series
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